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Temperature is another important factor to consider. An increase in temperature increases ion solubility, mobility, and reactivity. In summary, several factors affect electrochemical migration. These include the nature of substrate and metallization, the presence of contaminants, the voltage gradient, and the presence of sufficient moisture. This last element is critical, for without sufficient monolayers of water on the surface, ion mobility is impossible. A number of factors affect CAF formation. These include substrate material, conductor configuration, processing, voltage and spacing, soldering flux, and humidity in the storage and use environment. rdlc gs1 128 Packages matching GS1-128 - NuGet Gallery
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RDLC GS1-128 barcode control helps .NET users to print high quality GS1-128 barcodes using VB.NET codes on RDLC local reports. This barcode generation ... Substrate Material Lando et al.4 compared FR-4 with several substrates: G-10 (a non-fire-retardant epoxy/ woven glass material), polyimide/woven glass (PI), triazine/woven glass, epoxy/woven kevlar, and finally polyester/woven and chopped glass. Similarly, B. Rudra et al.8 performed an extensive experimental comparison among the substrates: bismaleimide triazine (BT), cyanate esters (CE), and FR-4. In addition, Ready9 compared the CAF susceptibilities of FR-4 with CEM-3 (a substrate similar to G-10 except with chopped glass) and MC-2 (a blended polyester and epoxy matrix with woven glass face sheets and a chopped glass core). Of all materials tested by these investigators, the BT material proved to be most resistant to CAF formation (due to its low moisture absorption characteristics). Conversely, the MC-2 substrate proved to have the least resistance to CAF formation. The susceptibility of the materials follows the trend below: MC-2 > Epoxy/Kevlar > FR-4 ~ PI > G-10 > CEM-3 > CE > BT To ensure immunity to CAF, the laminate of preference is BT. In recent years, laminate suppliers have developed other CAF-resistant substrate materials. However, there is a cost penalty to consider. 56.4.1.1 Conductor Configuration. Lando et al.4 evaluated several different conductor configurations: Line-to-line (L-L) Hole-to-line (H-L) Hole-to-hole (H-H) rdlc ean 128 RDLC GS1-128 .NET Barcode Generation Control - TarCode.com
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18 Mar 2019 ... Hello everyone,. I would like to print barcodes for each item in my inventory. I want to create an RDLC report which will contain barcode (as an ... This evaluation showed that susceptibility to CAF is H-H > H-L > L-L. Lahti et al.10 demonstrated that the smaller the spacing between conductors and the greater the proximity of the glass fibers to the copper conductors, the faster the growth of CAF. They noted that for a multilayer board, failure initiated in the most deeply buried layers. 56.4.2 Processing The epoxy-glass bond can be weakened by the drilling or depaneling processes in PWB manufacture. It will also be weakened during the soldering process due to the difference in coefficient of thermal expansion (CTE) of the epoxy and glass. Data from Turbini et al.11 demonstrated that the increased soldering temperature associated with lead-free alloys significantly increases the incidence of CAF. Another processing factor is the diffusion of polyglycols from water-soluble flux into the PWB substrate that occurs during soldering. Since the diffusion rate is temperature-dependent, the length of time that the board is above the glass transition temperature will affect the amount of polyglycol absorbed into the epoxy, and that will in turn affect its electrical properties. J. A. Jachim et al.15 reported on water-soluble flux-treated test coupons that were prepared using two different thermal profiles. Those which experienced the higher thermal profile exhibited a Surface Insulation Resistance (SIR) level that was an order of magnitude lower than those processed under less aggressive thermal conditions. 56.4.3 Voltage and Spacing Two other critical factors used in determining CAF susceptibility are voltage and spacing. The CAF growth is fueled by the electric field (V/d), and failure occurs more quickly with smaller spacing between conductors. Summary Effect of Soldering Flux It has been shown that polyglycols12 (which are found in water-soluble fluxes) diffuse into the epoxy during soldering.13 This absorption has been shown to reduce electrical performance by increasing moisture uptake by the substrate.14 Jachim et al.15 were the first to link the use of polyglycols in soldering fluxes and fusing fluids to increased susceptibility to CAF formation. Ready et al.16 showed that the use of certain water-soluble fluxes or fusing (hot air solder level [HASL]) fluids could increase CAF formation. In examining a catastrophic field failure (see Fig. 56.9), Ready et al.16 demonstrated the presence of a copper-bromide containing salt between an innerlayer power plane and ground pin, separated by 0.005 in. Using a test coupon manufactured in the same lot as the failed product, they extracted the flux residues from an innerlayer of the multilayer board and used ion chromatography to match the residues from the board s innerlayer with the constituents of the flux. FIGURE 56.9 Catastrophic field failure of military hardware. The conductive filament grew from the +20 V ground plane to the 20 V ground pin. Flux residues enhanced this failure rate.16 Here is what is going on in Program 13-1: rdlc ean 128 VB.NET GS1 - 128 (UCC/ EAN 128 ) Generator SDK - Generate ...
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