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The framework class that implements the application module functionality already provides methods for committing and rolling back the transaction. However, if you wish to augment that functionality, you can generate the application module implementation class and add your own code to this class. You can also define application module level methods that you want to expose to the consuming client. This is covered in more detail in 7.

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the entire joint. Figure 53.13 shows an example of these calibrated measurements. This figure includes the actual cross-sectional x-ray image of tape automated bonded (TAB) solder joints. The profile shown at the top of the x-ray image is generated by the system in physical dimensional units by interpreting and calibrating the grayscale readings of pin 193 in the x-ray image. The table below the x-ray image includes example measurements for both pin 193 and pin 194. Analysis of these physical thickness measurements of solder joints provides the information required for process characterization and improvement. For instance, variations in average solder thickness or volume for the solder joints across a single assembly or from assembly to assembly provide insight into the quality level of the paste printing process as well as sources of defects. The image-processing software then finds and measures solder joint features and flags defects accordingly.

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Advantages and Disadvantages of X-Ray Inspection X-ray solder joint inspection systems can reach average inspection speeds of around 50 to 150 joints per second. X-ray solder joint inspection systems also have higher prices, typically about 50 to 100 percent more than the price of the optical solder joint systems with the fastest inspection speed capability.

Tape-automated bond (TAB) 2.20

Good board (pin 6) Reference designator U1 pin 193 Inspection point Pad Heel Center Toe Pad Heel Center Toe Thickness (in 0.001") 0.59 1.18 0.69 1.34 0.58 1.20 0.68 1.30

FIGURE 53.13 Cross-sectional x-ray image of TAB solder joints. Image-processing software converts the grayscale readings of the image for pin 193 into the side profile of solder thickness shown above the image. The actual calibrated measurements of average solder thickness across the pad, heel fillet height, center thickness, and toe fillet height processed from the images of pins 193 and 194 are shown in the table below the x-ray image. These measurements indicate that both of these solder joints are good.

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of the Propeller Tool (Version 1.2.6). If you need specific information about the Propeller, you should refer to the data sheet. The very adequate Propeller Manual (Version 1.1) is suitable for beginners and can be downloaded from the Internet at no charge. Teaching materials are being developed and released by Parallax on a continuing basis. Discussion forums are in place and provide very helpful advice. An extensive Object Exchange is maintained by Parallax on their website. However, all current efforts are aimed at those already fairly comfortable with microprocessor programming. This book provides an information resource for the beginner. It attempts to fill the void with a simple learn by doing approach designed specifically for the beginner who knows very little about this chip but has some general familiarity with electronics and with microprocessor programming. Before we start I would like to share a secret with you: Once you learn to use the Propeller in its parallel processing environment, you will be hard pressed to ever again use a conventional processor for the kind of tasks small microcontrollers are designed for. The Propeller system is both incredibly powerful and incredibly easy to use. You will be glad to have learned how to use it.

Automated x-ray inspection of solder joints has the following major advantages:

Its defect detection capability is extremely high. It eliminates visual inspection by automating solder joint defect detection, thereby also reducing unnecessary rework due to false reject calls. It reduces rework analysis time by pinpointing defects to the exact solder joint.

It affords real-time process control of all three process steps paste printing, component placement, and solder reflow to lower defect rates and rework costs. It provides quantitative measurements to help permanently eliminate the causes of defects from all three process steps. It reduces failures at final assembly and in the field due to defective hidden solder joints and marginal solder joints due to insufficient solder or misalignment or excessive voids. During lead-free conversion, it can be used with minimal program tuning. Automated inspection of solder joints has the following limitations:

So far you have learned about static navigation, where, for a particular action, the control flow always navigates to the same task flow activity. You can, however, bring more flexibility into the task flow through the use of a router activity. This allows a rule to be evaluated and, depending on the result, navigate to different task flow activities.

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