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Simple low-technology PCBs or those that do not have stringent longterm reliability requirements may successfully use the materials covered by sheets 101 or 121, whereas very advanced products may need more stringent requirements, such as those covered by sheets 126 and 129 Finally, always check for the most recent revision of IPC4101, as new specification sheets will be added as more experience is gained and data are gathered..

External and Internal Conductor Charts Figure 16.1 is for sizing external conductors, whereas Fig. 16.2 is for internal conductors; both are from the IPC standard 2221. External refers to the outermost layers of the printed circuit board. Until recent years, internal trace heating data were not broadly published. Figure 16.2 represents a conservative approach to internal trace heating; it does not represent internal trace heating data, although it does represent half the current from the external trace-sizing chart.

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Each of the 32-bit processors in the Propeller chip is called a cog. The Propeller chip has eight of these cogs on it. The eight cogs can be run simultaneously, and each of them can perform one or more tasks, depending on how the tasks are designed and programmed. A cog can be programmed to perform more than one task if the tasks can be performed in the time available and do not interfere with one another. Because the Propeller system does not support the use of interrupts, anything that would have needed an interrupt in the usual single-processor environment needs to be assigned to its own cog in the parallel Propeller environment. There is no easy way to avoid this requirement, and because you have eight cogs at your disposal, there is usually no need to. Each of the cogs is a 32-bit logic engine with a sophisticated instruction set. Between them, the eight processors have access to 32KB of hub RAM. Each of these cogs can access this memory, one at a time, in a round-robin fashion. The access to the memory is synchronized by the system clock and is controlled by a hardware device called the system hub. Each cog gets access to the shared memory for the same amount of time. All the cogs can access the 32 input/output lines simultaneously. The timing constraints of how these interactions take place and what the latency is (meaning the worst-case delay) are described in the owner s manual and should not be a concern at

Trace Temperature Rise The trace temperature rise derived from a conductor-sizing chart represents the increase in the trace temperature above the local board temperature surrounding the trace. For example, if the board temperature is 85 C as a result of component heating, and the trace is designed for a 10 C rise, then the trace will be 95 C. The temperature rise is the increase in temperature that the trace experiences when current is applied.

How to Use the Charts Conductor sizing charts require knowing two of three variables: current, trace temperature rise, or trace size If you know any two of these variables, you can calculate the other When a more accurate estimate of the trace temperature rise is needed, board thickness, copper thickness, and board material are also used 16431 Chart Basics:Known Current When the current and the desired temperature rise are known, then the trace width can be calculated for various trace thicknesses A 10 C rise is a common temperature rise for a design The temperature rise should always be minimized If the designer can manage a 1 C rise or less, then the contribution to board heating will be minimized Increasing the size of a trace lowers the temperature rise, lowers the voltage drop, decreases component temperatures, and improves the reliability of the product.