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these techniques are either less consistent or less well defined than a visual image, still requiring the inspector to make a difficult judgment call Therefore, a low repeatability rate persists 53645 High-Complexity Boards Many printed circuit boards today are entirely too complex to allow accurate visual inspection Components as small as 0402, 0201, or even 01005 passive components are simply too small for accurate visual detection of missing parts and particularly misalignment defects Add to this the fact that many printed circuit boards have hundreds of these component types per board, and the opportunity for the visual inspector to make a mistake becomes enormous Further obstacles to accurate inspection are families of boards, where the basic layout of each board type is the same, but specific board types vary by purposely not mounting specific components.

In these cases, a missing component can be completely acceptable even in places where the board layout may provide for a component to be mounted 53646 No Quantitative Measurements Accurate quantitative measurements of dimensions ranging from 005 to 05 mm are not possible with visual inspection Quantitative measurements provide much more information about a process step, allowing much tighter process control and providing insight into the causes of process variation, without which process improvement is a hit-or-miss proposition Some manufacturers have implemented semiautomatic measurement tools to allow operators to take quantitative measurements Examples include optical-focusing microscopes and semiautomatic laser triangulation equipment These tools do collect useful quantitative measurements, but are typically limited to sampling Sampling is required because the tools are very slow.

Measurement of solder paste height, volume, and registration with pads is possible because of easy visual access to solder paste depositions as well as their simple rectangular shape Automated inspection techniques using automated inspection equipment significantly overcome the repeatability and measurement limitations of visual inspection It is for this reason that many manufacturers are implementing automated inspection..

Determine the sequencing requirements for the motor coils. Read a potentiometer that we will use to set the speed of the motor. Manage the power to the amplifiers for the two motor coils. Manage the LCD to display information of interest to us as we run the motor.

The automation of inspection has evolved into systems that resemble the automated test equipment used to make electrical measurements and find electrical defects (faults). Automated inspection systems generate images of the item to be inspected (normally solder paste, components, or solder joints), digitally analyze the image to locate and measure key features, and, based on these measurements, automatically decide whether a defect exists or not. Just like visual inspection, automated inspection systems do not require physical contact with the printed circuit assembly to generate the desired images. Unlike visual inspection, however, automated inspection removes human subjectivity from defect detection, thereby increasing repeatability rates typically by an order of magnitude. Many of the automated inspection systems also provide accurate, repeatable, quantitative measurements that directly correspond to process parameters, thus providing the means for process control and improvement.2

Measurements by Automated Inspection Systems Figure 53.8 shows examples of measurements made by automated inspection systems. 53.7.1.1 Solder Paste Measurements. Typical solder paste measurements, shown in Fig. 53.8(a), are volume, area of pad covered, height, and misalignment with the pad. These quantitative measurements provide information about the paste viscosity, stencil registration, cleanliness, snap-off, and squeegee speed and pressure that can lead to improvement in the paste printing process.

FIGURE 53.8 Measurements made by automated inspection systems: (a) Typical solder paste measurements made by automated inspection systems, including the volume of paste deposition, area of the pad covered by paste, height of the paste deposition, and offset of the paste from the pad; (b) typical component placement attributes inspected by automated inspection systems, including missing component, components misaligned along or across the pads, and skewed components; (c) typical solder joint measurements made by automated inspection systems, including volume of solder, toe and heel fillet heights, distance between fillets, void volume, average solder thickness across the solder joint, and offset between the solder joint and pad.

53.7.1.2 Pre-Reflow Measurements. Typical pre-reflow component placement measurements, depicted in Fig. 53.8(b), include whether or not the component is missing, misaligned, or skewed.These measurements are usually attribute measurements, just separating good from bad. But quantitative dimensional measurement of the amount of misalignment, just after the placement process step, is also possible. Component placement measurements provide information about the rate of placement accuracy. Optical character recognition (OCR) and optical character verification (OCV) techniques allow for additional levels of verification, including correct part. 53.7.1.3 Post-Reflow Solder Joint Measurements. Solder joint measurements, such as fillet heights, average solder thickness across the pad, void volume, and pin-to-pad offsets, as shown in Fig. 53.8(c), provide information about the paste printing process, the component placement process, and the solder reflow process steps. Attribute measurements, such as solder bridges, opens, or insufficient solder, are most common. Quantitative measurements of solder