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Quick Defect Detection and Correction Quick detection of process shifts or defects can lower rework costs. 53.3.3.1 Preventing Defects. If a particular process step has drifted out of its control limits or specification limits, discovering this fact as soon as possible will prevent more defects from occurring. If the problem is found quickly enough and corrected immediately, perhaps no actual defects will occur. 53.3.3.2 Lowering Rework Costs. Defects found earlier in the process are often easier to repair. For instance, if a defect in solder paste deposition is found before a component has been placed in the paste, it is fairly inexpensive to wipe the solder paste off and start over. If this same defect is found after the solder is reflowed, the solder joint itself will have to be touched up, a more difficult and expensive rework step.The same is true for repairing component placement defects before the solder is reflowed, particularly for missing or misaligned components. Additionally, when organic solderability preservative (OSP) boards are being utilized for leadfree soldering, for example, they cannot be reworked as easily. Using process control and defect prevention can prevent a large number of non-reworkable boards in this case. 53.3.3.3 Making Defect Diagnosis Easier. Defects found earlier in the assembly process are often more easily diagnosed, shortening the overall repair time. An example is the inspection of solder joints. Inspection of solder joints detects defects specific to the solder joints and quickly determines each defect s exact location and characteristic. Waiting until a later electrical test stage could make diagnosis more difficult because at that point there could be several causes of the defect, such as a defective component and defects in other connections, in addition to the actual defective solder joint. asp.net ean 13 EAN - 13 ASP . NET Control - EAN - 13 barcode generator with free ...
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19 Apr 2005 ... NET 2005 - 7.40 Kb ... The EAN - 13 barcode is composed of 13 digits, which are made up of the following sections: the first 2 or 3 digits are the ... 53.3.4 Statistical Process Control SPC requires reliable data that can be analyzed either in real time or historically. Visual inspection collects defect data, such as the number of solder joint defects per assembly right after the solder reflow process (either reflow or wave soldering). Some manual and automated inspection techniques also take quantitative measurements of key assembly parameters, such as solder paste volume or solder joint fillet height. To the extent that these data are repeatable, manufacturers use defect data or measurements to characterize the amount of process variation from assembly to assembly or from solder joint to solder joint. When the amount of variation starts to drift outside its normal range or outside its control limits, manufacturers can assess the assembly process and monitor or choose to take action until the process is adjusted to eliminate this drift. Historical analysis of the defect or measurement asp.net ean 13 .NET EAN 13 Generator for C#, ASP . NET , VB.NET | Generating ...
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NET Core Barcode is a cross-platform Portable Class Library that generates barcodes using barcode fonts. It supports Windows, macOS and Linux, and can be ... data also helps discover the cause of process variation. Eliminating the sources of process variation reduces the process defect rate, thus creating savings in rework costs and increasing product reliability. As shown in Figure 53.4, various charts to display available data from the automated inspection can be made available for corrective action and process control. Other chapters of this book have covered the lead-free process, but this section covers the lead-free process from an inspection point of view. In general, the lead-free process is a less forgiving one because the wetting forces for lead-free alloys are not as strong as for tin-lead, which means that defect levels are likely to increase and the need for inspection for process control and defect containment will increase. The figures illustrate wetting issues of the leadfree process. Figures 53.5 and 53.6 show x-ray close-ups of two gull-wing joints on the same type of quad flat pack (QFP) device. A key issue for manufacturers is the lead-free alloy melting point of 217 C, higher than the 183 C for lead alloys. The higher melting point will have significant impact on manufacturing processes and potentially on component reliability. During the transition to a lead-free process, it is Side fillets are the important to understand all of the materials in use, as same size mixing lead-free and traditional tin-lead components will create many issues during the transition to a leadfree process Ideally, all lead-free components and materials will be utilized, but this is not always possible Note good Figure 535 is an x-ray image of a tin-lead example A heel and toe good heel formation and toe formation can be seen The formation side fillets are approximately the same, indicating that the component pins are centered on the pad Note also that very little solder appears on the pad below the toe Sn/Pb in the photo; all solder is around the component pins Figure 536 is an x-ray image of a lead-free example and reveals a couple of wetting issues Solder is over the full pad. asp.net ean 13 EAN - 13 Barcode Generator for ASP . NET Web Application
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